Galden® LS215 Perfluoropolyether Vapor Phase Soldering Fluid | Boiling Point: 200-260℃
LS215
Galden® LS/HS are perfluoropolyether fluids developed by Syensqo (formerly Solvay) specifically for Vapor Phase Soldering (VPS) processes. Available in five graded boiling point models: LS200/215/230 and HS240/260, covering the full lead-free soldering temperature range of 200-260℃. Featuring narrow molecular weight distribution for zero boiling point drift, non-flammable, non-combustible and explosion-proof, zero ODP and RoHS compliant. It is the preferred heat transfer fluid for high-reliability lead-free soldering.
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Product Overview
Galden® LS/HS is a fully fluorinated perfluoropolyether (PFPE) fluid exclusively formulated for vapor phase soldering. Its robust carbon-fluorine bonds and flexible ether bonds deliver outstanding thermal stability and chemical inertness, enabling long-term safe operation below 290℃.
The complete series includes five temperature-graded variants: LS200 (200℃), LS215 (215℃), LS230 (230℃), HS240 (240℃) and HS260 (260℃), which precisely match melting points of various lead-free solders and fully cover the full temperature range from preheating to soldering.
Technical Specifications
| Parameter | Unit | LS200 | LS215 | LS230 | HS240 | HS260 |
|---|---|---|---|---|---|---|
| Boiling Point | ℃ | 200 | 215 | 230 | 240 | 260 |
| Density | g/cm³ | 1.79 | 1.80 | 1.82 | 1.82 | 1.83 |
| Kinematic Viscosity | cSt | 2.50 | 3.80 | 4.40 | 5.30 | 7.00 |
| Vapor Pressure | Pa | 21 | 12 | 3.4 | 1 | 1 |
| Specific Heat Capacity | J/Kg·℃ | 973 | 973 | 973 | 973 | 973 |
| Heat of Vaporization | J/g | 63 | 63 | 63 | 63 | 63 |
| Thermal Conductivity | W/m·℃ | 0.07 | 0.07 | 0.07 | 0.07 | 0.07 |
| Volume Expansion Coefficient | cm³/cm³·℃ | 0.0011 | 0.0011 | 0.0011 | 0.0011 | 0.0011 |
| Surface Tension | dyne/cm | 19 | 20 | 20 | 20 | 20 |
| Dielectric Strength | kV (2.54mm gap) | 40 | 40 | 40 | 40 | 40 |
| Dielectric Constant | — | 2.1 | 2.1 | 2.1 | 2.1 | 2.1 |
| Volume Resistivity | Ohm·cm | 10¹⁵ | 10¹⁵ | 10¹⁵ | 10¹⁵ | 10¹⁵ |
Core Advantages
- Precise boiling point with zero drift: Narrow molecular weight distribution ensures stable boiling point during long-term service and excellent process repeatability.
- Full temperature range coverage: 5 graded boiling points from 200℃ to 260℃, perfectly compatible with mainstream lead-free solders such as SAC305 (melting point 217℃).
- Inherent safety: No flash point, fire point or autoignition point, free from explosion risks for safe high-temperature operation.
- Superior chemical inertness: Non-corrosive to all metals and structural materials, no decomposition residues generated.
- Higher vapor density than air: Soldering proceeds under inert atmosphere without additional nitrogen protection.
- Low heat of vaporization: Fast drying with zero residue, no post-soldering cleaning required.
Environmental Protection & Safety
- Zero ozone depletion potential (Zero ODP), eco-friendly to atmospheric environment.
- Compliant with RoHS directives, fully meeting lead-free process standards.
- Non-toxic, friendly to operators and improving workshop safety conditions.
- Stable long-term service below 290℃, thermal decomposition temperature far exceeds actual process requirements.
Application Fields
- Lead-free Soldering: Driven by RoHS regulations, the melting point of lead-free solders rises from 180℃ of traditional Sn/Pb solders to around 227℃. Vapor phase soldering achieves precise temperature control and uniform heating, becoming the optimal solution for high-reliability lead-free soldering.
- High-density PCB Assembly: With compact PCB layout in smartphones, wearables and other miniaturized electronic products, traditional convection and radiation heating cause shadow effect, while vapor phase soldering realizes dead-angle-free uniform heating.
- Heterogeneous Packaging Soldering: Chiplet, SiP and other heterogeneous integrated packaging require strict temperature uniformity. Vapor phase soldering effectively avoids local overheating and tombstoning defects.
- Semiconductor Device Packaging: Ideal for heat-stress-sensitive processes including IC substrate soldering and power device packaging.
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