In-depth Application of Electronic Fluorinated Fluids in Semiconductor Manufacturing: A Full Analysis of TUW Series from Equipment Temperature Control to Precision Cleaning

2026-10-12

Across the entire semiconductor manufacturing flow, electronic fluorinated fluids are an auxiliary material that is easily overlooked yet critically important. Unlike wet chemicals that act directly on the wafer surface, electronic fluorinated fluids work mainly on the equipment side and perform two core functions: equipment temperature control and cooling, and precision component cleaning.

In terms of product architecture, electronic fluorinated fluids fall into two main categories. The first is heat transfer fluids for equipment temperature control, including hydrofluoroether (HFE) and perfluorocarbon (PFC) systems, which offer a wide temperature range, high electrical insulation and chemical inertness. The second is hydrofluoroether (HFE) cleaning agents for precision cleaning, known for low surface tension, low residue and good material compatibility.

Electronic fluorinated fluids do not take part in wafer processes directly, yet by keeping equipment running stably and components clean they indirectly affect process yield and product consistency. As advanced nodes keep raising requirements for temperature control accuracy and cleanliness, these fluids have been upgraded from a general heat transfer medium to a key material that influences equipment stability and yield.

1. Equipment Temperature Control: Why Semiconductor Equipment Cannot Do Without Electronic Fluorinated Fluids

1.1 Temperature Control Pain Points in Etch, Deposition and Test Equipment

In semiconductor manufacturing, etch, deposition and test equipment must keep key locations such as the process chamber, electrostatic chuck (ESC) and wafer stage at a stable temperature during operation. In plasma etching, for example, a slight fluctuation in chamber temperature directly affects etch rate, selectivity and profile accuracy, and further affects device electrical performance and yield. At advanced nodes, equipment temperature control accuracy has reached the ±0.1 ℃ level.

1.2 Performance Thresholds for Heat Transfer Fluids and the Closed-Loop Circuit

Semiconductor equipment heat transfer fluids must meet several requirements at the same time; cooling performance alone is not enough to qualify for core equipment applications:

Table 1 Performance requirements for semiconductor equipment temperature control fluids

Requirement	Equipment pain point	Value of electronic fluorinated fluids
Wide temperature range	Low-temperature and high-temperature operating conditions in etch and test equipment	Covers multiple temperature zones and does not freeze at low temperatures
Low viscosity	Circulating resistance rises in a low-temperature environment	Maintains flow and heat transfer efficiency
Electrical insulation	The control loop runs close to plasma, electrodes and high-voltage components	High dielectric strength, lower electrical risk
Chemical inertness	Corrosive gases and by-products are present in the etch chamber	Long-term stability with no reaction and no corrosion
Low volatility and low residue	Chamber contamination affects yield and stability	Reduces contamination and process drift
Material compatibility	Long-term contact with tubing, seals, pumps and valves	No swelling, no aging, no leakage

The typical application of electronic fluorinated fluids is a closed-loop circuit built around a chiller/TCU temperature control unit. Facility cooling water provides the primary cold source; after precise adjustment by the temperature control unit, a pump drives the heat transfer fluid through filters and heat exchangers into the process chamber, electrostatic chuck and chamber walls, where it removes process heat and returns to the unit, forming a complete closed loop. The closed design keeps the heat transfer fluid from direct contact with process gases or the chamber environment, avoiding contamination risk.

2. Precision Cleaning: How HFE Became the First Choice for Low-Residue Cleaning

2.1 Higher Cleaning Requirements for Components as Process Nodes Advance

As process nodes advance, cleaning requirements for equipment components keep rising. Chamber parts, valves, showerheads, optical components and advanced packaging parts face increasingly strict requirements on residue control, material corrosion and drying cleanliness. Conventional cleaning agents tend to have high surface tension, poor penetration and high residue, making it difficult to meet the cleanliness requirements of advanced nodes.

2.2 Low Surface Tension Delivers Penetration and Low Residue

With a low surface tension of 10-18 mN/m, hydrofluoroether (HFE) penetrates micron-scale gaps and, through immersion cleaning, vapor degreasing, spray cleaning and wipe cleaning, removes oils, wax, particles, ionic contamination and flux residue, leaving almost no residue after evaporation.

Table 2 Typical HFE cleaning targets and their value

Cleaning target	Typical contaminants	Cleaning method	Value of HFE
Semiconductor equipment chamber parts	Oils, particles, organic residue	Immersion, vapor degreasing	Good penetration into complex structures, low residue
Valves, showerheads and tubing	Metal micro-contamination, particles, oil	Spray, precision cleaning	Material compatibility, lower corrosion risk
Optical components and precision electronics	Fingerprints, particles, ionic contamination	Wipe, spray	No damage to components, fast drying
PCBs, connectors and packaging parts	Flux residue, organic contamination	Vapor degreasing, immersion	Low surface tension, environmentally friendly alternative

3. The TUW Series: A Complete Domestic Substitution Solution from Temperature Control to Cleaning

The TUW series of electronic fluorinated fluids from Shenzhen Huayi Brothers covers both semiconductor equipment temperature control and precision cleaning, giving downstream customers a domestic substitution option benchmarked against international original-equipment models.

3.1 Temperature Control Line: High- and Low-Temperature Heat Transfer Options Benchmarking International Brands

Temperature control product line:

Table 3 TUW series temperature control product line

Model	Equivalent to	Key characteristics	Typical applications
TUW-40	Novec 40	Temperature range -55 °C to 155 °C, single-component high boiling point	High-temperature operation of etch, ion implantation and inspection equipment
TUW-3283	FC-3283	Boiling point 128 °C, electrolytically purified high-purity perfluorocarbon	Temperature control for etch, ion implantation and CVD equipment
TUW-7500	Novec 7500	GWP=1, melting point -93 °C, hydrofluoroether	Immersion cooling for AI data centers
TUW-770	FC-770	Pour point -127 °C, perfluorocarbon	Cooling for supercomputing, defense electronics and high-voltage components
TUW-7300	Novec 7300	Hydrofluoroether for dual temperature control and cleaning use	Semiconductor cooling, precision electronics cleaning
TUW-7200	Novec 7200	Multi-purpose for cleaning, leak testing and constant temperature	Electronics cleaning, leak testing, constant-temperature baths

3.2 Precision Cleaning Line: From Precision Degreasing to Coating Protection

Precision cleaning product line:

Table 4 TUW series precision cleaning product line

Model	Key characteristics	Typical applications
TUW-71IPA	Boiling point approx. 57 °C, surface tension 16 mN/m	Rapid cleaning and degreasing of precision electronic parts
TUW-71DA	Azeotrope, no flash point	Immersion defluxing, degreasing
TUW-72DA	Azeotrope, medium to heavy duty degreasing	PCBA flux cleaning, vapor degreasing
TUW-72DE	Azeotrope, solvent for coating and lubricant deposition	Dual use for degreasing and coating deposition
TUW-73DE	Heavy-duty vapor degreasing	Cleaning of complex geometry parts
TUW-7100	Nonafluorobutyl methyl ether, multi-purpose	Chamber cleaning, FOUP cleaning, immersion cooling
TUW-347	HFE environmentally friendly solvent	Drying, dust removal, removal of non-condensable gases
TUW-458	HFE environmentally friendly solvent	Drying, dust removal, electrolyte additives

In addition, the TUW-2704 electronic coating agent provides PCBs and electronic components with an ultra-thin, moisture-resistant and corrosion-resistant coating, completing the full cycle of temperature control, cleaning and protection. All TUW products share zero ODP, low GWP, non-flammability with no flash point and excellent electrical insulation, meet RoHS and other environmental requirements, and are long-term stable ODS alternatives.

4. Conclusion

As a key auxiliary material on the equipment side of semiconductor manufacturing, electronic fluorinated fluids are seeing growing demand as advanced nodes advance. As international fluorochemical manufacturers progressively adjust their PFAS product lines and supply uncertainty increases, domestically produced electronic fluorinated fluids face a historic opportunity. Shenzhen Huayi Brothers focuses on the supply of electronic fluorinated fluids and fluorine-containing functional liquids. The TUW series covers the full range from low-temperature drying to high-temperature temperature control, and from precision cleaning to coating protection, and provides customers with product documentation, sample testing and application discussions. For sample testing, please contact us through the panel on the right.

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